process engineer in Kuala Lumpur

posted
contact
shelly yong, randstad
job type
permanent
salary
RM 60,000 - RM 96,000 per year

job details

posted
location
kuala lumpur, wilayah persekutuan
specialism
engineering
job type
permanent
working hours
Full-Time
salary
RM 60,000 - RM 96,000 per year
experience
5 years
reference number
91M0149571_1602595525
contact
shelly yong, randstad
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job description

You will be joining as a part of the MNC company who is the original pioneer of the OSAT industry. You will enjoy the cultural diversity and highest standards of integrity, respect, and fair dealing.

In this company, you will need to:

  • Able to identify, develop and resolve process related issues for continuous improvement in yield, quality, reliability, and productivity.
  • Handle abnormal lot disposition, decide failure analysis method, analyze the result & make judgement including establish good communication with the Customer on the lot proceeding to avoid quality risk for shipment.
  • Responsible to establish, improve & maintaining Product and Process OCAP timely.
  • Lead the MFG team on internal or external auditing on responding to relevant dept, including coordinating with other dept support for item closure.
  • Responsible to establish, improve and maintain MFG operational SOP to reduce/ eliminate operation variation among the shift for better & stable manufacturing ability.
  • To manage LVM for any new change introduce to MFG Line including preparation for initial start to manage the risk of quality & manufacturability for newly introduced item.
  • Responsible to improve, maintain Process Flow, Control Plan as well as FMEA which the input may come from the above clause risk management, improvement activities, claims, audit findings & internal process gate findings.

You will need to possess:

  • Masters/Bachelor’s Degree in Engineering (Mechanical / Electrical / Microelectronics / Mechatronics / Semiconductor Technology, Material science) or equivalent
  • At least 5 years of working experience in semiconductor.
  • Knowledge in semiconductor assembly processes, preferably die attach, wire bond process.
  • Ability to multitask and make effective decisions in support of a compact project plan, using sound communication skills, influencing power and negotiation skills both internally and externally with all stake holders.
  • Team player with strong analytical abilities, problem solving skill in SPC, statistical data analysis and DOE will be an added advantage.

skills

Knowledgeable in semiconductor assembly processes, preferably die attach, wire bond process

qualification

-Masters/Bachelor’s Degree in Engineering (Mechanical / Electrical / Microelectronics / Mechatronics / Semiconductor Technology, Material science) or equivalent

educational requirements

Bachelor Degree