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    2 jobs found for Assistant in Penang, Pulau Pinang

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      • penang, pulau pinang
      • permanent
      • RM7,000 - RM8,500 per month, allowance, bonus, claims
      We are looking for a Sales Manager or Senior Account Lead with 5+ years of electronics or semiconductor industry experience to drive regional sales across Penang’s tech ecosystem.Job HighlightsGreat Package: Competitive compensation with managerial title allowance, travel allowance, and full medical benefits.Northern Tech Hub Focus: Direct exposure to Tier-1 semiconductor and microchip assembly plants in Penang.About the CompanyA prestigious multi-billion-
      We are looking for a Sales Manager or Senior Account Lead with 5+ years of electronics or semiconductor industry experience to drive regional sales across Penang’s tech ecosystem.Job HighlightsGreat Package: Competitive compensation with managerial title allowance, travel allowance, and full medical benefits.Northern Tech Hub Focus: Direct exposure to Tier-1 semiconductor and microchip assembly plants in Penang.About the CompanyA prestigious multi-billion-
      • penang, pulau pinang
      • permanent
      • RM4,000 - RM6,500 per month, allowance, bonus, claims
      We are looking for a Senior Technical Sales Executive or Assistant Manager with a technical degree and 3+ years of semiconductor materials experience to lead account growth across central Malaysia.Job HighlightsComprehensive Benefits: Title allowance, travel allowance, season parking pass, and full medical coverage.Specialized Semiconductor Exposure: Deep involvement with semiconductor packaging materials (Epoxy Moulding Compounds, thermal interfaces, sili
      We are looking for a Senior Technical Sales Executive or Assistant Manager with a technical degree and 3+ years of semiconductor materials experience to lead account growth across central Malaysia.Job HighlightsComprehensive Benefits: Title allowance, travel allowance, season parking pass, and full medical coverage.Specialized Semiconductor Exposure: Deep involvement with semiconductor packaging materials (Epoxy Moulding Compounds, thermal interfaces, sili

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