senior packaging engineer – power modules (semiconductor).

• Lead packaging engineering and development activities for advanced semiconductor power modules, covering package structure, material selection, process integration, and manufacturability.
• Develop and optimise packaging processes, including component attach, flip-chip, reflow, molding, and substrate/leadframe assembly technologies.
• Drive new product development from prototyping, process characterisation, qualification through to manufacturing release.
• Evaluate package configurations, material compatibility, and reliability requirements to ensure robust package performance.
• Collaborate with cross-functional engineering, R&D, manufacturing, and global technical teams to support technology development and process improvements.
• Drive yield improvement, process optimisation, defect reduction, and manufacturing cost competitiveness.
• Apply engineering methodologies such as DOE, FMEA, SPC, and statistical analysis to resolve technical challenges.

about the requirement

• Bachelor's Degree in Mechanical Engineering, Materials Science, Electrical/Electronic Engineering, Physics, or related disciplines.
• Preferably 5–12 years of experience in semiconductor packaging engineering or development, with hands-on exposure to power modules.
• Strong fundamental understanding of module package structures, configurations, process integration, and material compatibility.
• Experience in semiconductor packaging process development, material selection, assembly integration, or package reliability.
• Familiarity with advanced packaging technologies such as SiP, ETS, MIS, PoL, SMT, substrate/leadframe packaging, or TO/SiC/GaN power modules will be an added advantage.
• Knowledge of DFM, process optimisation, and semiconductor assembly technologies.
• Experience in project management, particularly in packaging development, NPI, or semiconductor assembly operations, is advantageous.
• Strong analytical, problem-solving, and cross-functional collaboration skills.