We are partnering with a Fortune 500 powerhouse that designs and manufactures the foundational chips powering nearly every modern technology from autonomous vehicles to industrial automation.
As they execute a multi-billion dollar expansion of their world-class Assembly & Test operations in Malaysia, we are looking for a high-calibre Equipment Engineer to take technical ownership of advanced Wirebond platforms.
Based in Malaysia.
Job Responsibilities:
- Assess, select, and procure manufacturing equipment, focusing on cost-effectiveness and suitability for product manufacturing.
- Manage the installation, modification, upgrades, and ongoing maintenance of all production equipment.
- Stay informed on technical updates, safety alerts, and upgrades from equipment manufacturers.
- Analyse equipment performance and reliability metrics.
- Develop and implement strategies and solutions to boost equipment uptime and resolve issues impacting the manufacturing process.
- Offer specialised technical assistance to the process engineering and equipment repair teams.
- Document and define preventative maintenance schedules.
Qualifications
- Bachelor degree of Electronics or Electrical Engineering, Mechanical Engineering, or related engineering degree.
- Minimum 3 years as Wire bond Equipment Engineer with KNS and ASM wire bond equipment maintenance experience in semiconductor manufacturing operations.
- Equipped with Wire bond process experiences will be added advantage.
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